德邦科技股份有限公司是专业从事高端电子封装材料研发及产业化的国家级专精特新重点“小巨人”企业，荣膺山东省首批“瞪羚企业”称号。

主要产品包括集成电路封装材料、智能终端封装材料、新能源应用材料、高端装备应用材料四大类别，产品广泛应用于晶圆加工、芯片级封装、功率器件封装、板级封装、模组及系统集成封装等不同的封装工艺环节和应用场景。

德邦®致力为客户提供一站式产品解决方案和技术服务。

Darbond Technology Co., Ltd. is a national-level specialized and new "little giant" enterprise specializing in the research and development and industrialization of high-end electronic packaging materials. Its main products include integrated circuit packaging materials, smart terminal packaging materials, and new energy application materials, Four categories of high-end equipment application materials, widely used in wafer processing, chip-level packaging,power device packaging, board-level packaging,module and system integration packaging and other packaging process links and application scenarios.

Darbond® is committed to providing customers with one-stop product solutions and technical services.